Infineon has partnered with Schweizer to develop more efficient silicon carbide solutions for vehicles

     Infineon Technologies and Schweizer Electronic announced a partnership to further improve the efficiency of silicon carbide (SiC) chips through innovation. The two parties are developing a new solution designed to embed Infineon's 1200V CoolSiC™ chips directly into PCB boards to significantly increase the range of electric vehicles and reduce the total cost of the system.

     The collaboration between the two companies has demonstrated the potential of this new approach: they have improved performance by 35% by embedding a 48-V MOSFET device in the PCB. Behind this effort is Schweizer's innovative p²Pack® solution, which supports the embedding of power semiconductors into PCBS.

     "It is our common goal to take automotive power electronics to the next level," said Robert Hermann, product line leader for automotive scale high voltage discrete devices and chips at Infineon Technologies. PCB's low inductance design enables fast switching. Combined with the leading performance of the 1200 V CoolSiC™ device, embedding the chip into the PCB board helps to design highly integrated, energy efficient inverters and reduce overall system costs."

     "With 100 percent of Infineon's standard S-cells that have passed electrical safety tests, we are able to enable high volumes across the p²Pack manufacturing line," said Thomas Gottwald, vice president of technology at Schweizer Electronic. The low inductance interconnect implemented by p²Pack also provides strong support for the fast switching characteristics of CoolSiC chips. The combination can significantly improve the efficiency and reliability of power conversion units such as traction inverters, DC-DC converters, or on-board chargers."