Technology Articles

2025-07 Passive Components Caddock Electronics

[lug 8 2025] Cadence Electronics (USA) recently announced the expansion of its system IP portfolio with the addition of Cadence® Janus™ Network-on-Chip (NoC). As today's computing needs continue to increase, larger and more complex system-on-chips (SoCs) and disaggregated multi-chip systems are rapidly gaining popularity in the market, and data transmission within and between silicon components has become inc ...

2025-07 Passive Components OSRAM Opto Semiconductors Inc.

[lug 4 2025] Mouser Electronics, a leading global distributor specializing in the introduction of new electronic components and industrial automation products, has announced the availability of the ams OSRAM Mira016 CMOS image sensor. This compact, high-sensitivity sensor is poised to accelerate innovation across industrial, robotics, wearable, and machine vision markets. The Mira016 is a 0.16-megapixel globa ...

2025-07 Connectors Molex

[lug 2 2025] The demand for faster, more reliable, and easier-to-maintain fiber connections is growing as hyperscale data centers expand. To keep up, Molex has introduced VersaBeam EBO, a plug-and-play expanded beam optical (EBO) connectivity solution designed to simplify deployment, reduce maintenance, and improve long-term reliability. Why VersaBeam EBO? Traditional fiber connectors are highly sensitive to ...

2025-03 Power Power Integrations

[mar 26 2025] Power Integrations, a well-known company in the field of energy-efficient power conversion for high voltage integrated circuits, announced the introduction of TinySwitch™-5, extending the output power of its popular family of integrated offline switching ics to 175W. The new TinySwitch-5 uses simple diode rectification and optocoupler feedback to achieve up to 92% efficiency. More than 6 billion ...

2025-03 Connectors TDK

[mar 26 2025] TDK has introduced the FS160* series of MicroPOL (μPOL) power modules, which offer superior power density and full telemetry in an ultra-compact size, and are now in mass production. These μPOL DC-DC converters provide enhanced performance while maintaining a very small footprint. Measuring just 3.3mm x 3.3mm x 1.35mm, each FS160* module is ideal for integration into designs with ASics, Measuring ...

2025-03 Semiconductors Microchip Technology

[mar 25 2025] To enable more engineers to enjoy more powerful programming and debugging capabilities, Microchip Technology Inc. released the MPLAB PICkit Basic online debugger to provide a cost-effective solution for engineers at all levels. Compared to other complex and expensive debuggers, this economical tool offers high-speed USB 2.0 connectivity, CMSIS-DAP support, and compatibility with multiple integrat ...

2025-03 Semiconductors Analog Devices

[mar 25 2025] Analog Devices, Inc. has expanded its developer-focused suite with new solutions designed to help developers improve efficiency and security while creating greater value for customers. CodeFusion Studio System Planner helps customers innovate at the intelligent edge, improve functionality, and speed product to market. The new data traceability software development solution is designed to build a ...

2025-03 Passive Components Vishay

[mar 25 2025] Vishay Intertechnology, Inc. announced the launch of a new line of AEC-Q200 certified Power Metal Strip shunt resistors, WSBE, with TCR as low as ± 10 ppm/°C, one of the lowest in its class. With resistance values as low as 15 μΩ and power ratings up to 50 W, the Vishay Dale WSBE family of devices is suitable for automotive, energy, industrial and space applications. These devices have ultra-low ...

2025-03 Connectors STMicroelectronics

[mar 24 2025] STMicroelectronics, the world's leading semiconductor company serving multiple electronic applications, has announced the next generation of STM32 energy-efficient short-range wireless microcontrollers (MCUS) that simplify the connectivity of consumer electronics and industrial devices to the Internet of Things. The STM32WBA6 new series of microcontrollers are used for iot smart devices, such as ...

2025-03 Semiconductors Nexperia

[mar 24 2025] Nexperia has launched a series of highly efficient, stable and reliable industrial-grade 1200 V silicon carbide (SiC) MOSFETs. This family of devices performs well in terms of temperature stability and uses the innovative Surface Mount (SMD) top-cooling package technology X.PIC. The compact X.AK package, measuring only 14 mm ×18.5 mm, cleverly combines the convenient advantages of SMD technology ...

2025-03 Passive Components Littelfuse

[mar 24 2025] Lithium-ion batteries have played an important role in the development of electric vehicles (EVs). Electric vehicles have become a sustainable means of transportation, but the ultimate vision of electric vehicles is still far away. Engineers and embedded system professionals are looking for better power through supercapacitors. Some experts believe that supercapacitors are a solution that can all ...

2025-03 Semiconductors Memsic Inc.

[mar 21 2025] MediaTek launches high-performance Genio 720 and Genio 520 edge ai iot platforms. These new products in the Genio family support the latest generative AI models, HMI, multimedia and connectivity capabilities for smart home, retail, industrial and commercial iot devices. With superior edge performance and built-in Mediatek 8th-generation NPU, these devices offer up to 10 TOPS, providing full hardw ...