Technology Articles

2012-01 Connectors SMC Diode Solutions

[gen 15 2012] SMSC announces DARR84, the industry's most integrated advanced wireless audio processor. The device supports three frequency bands and is designed to provide uncompressed wireless multi-channel and multipoint audio capabilities for consumer audio and gaming applications. It is the latest addition to SMSC KleerNet's family of low-latency, low-power wireless audio solutions. Jordan Watters, vice pr ...

2012-01 Power Qualcomm

[gen 14 2012] Qualcomm Atheros, Qualcomm's networking and connectivity technology subsidiary, announced the launch of the first generation of Wi-Fi wireless display peer-to-peer solutions. The technology is Qualcomm's first solution and will form the basis for a new generation of interoperable consumer electronics, allowing users to easily share content between devices without requiring an Internet connection, ...

2012-01 Connectors Molex

[gen 13 2012] Molex introduces the enhanced Small Size Pluggable + (zSFP+) Surface Mount Technology (SMT) 20-way connector that delivers outstanding performance for high-speed telecommunications and data communications equipment. Designed specifically for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the new zSFP+ interconnect components are scalable for next generation applications and pro ...

2012-01 Connectors STMicroelectronics

[gen 12 2012] STMicroelectronics launched the world's first dual-core gyroscope L3G4IS that can simultaneously handle the two functions of user action recognition and camera image stabilization. The innovative system architecture allows equipment manufacturers to perform two different functions with only one gyroscope. To optimize the size, system complexity and cost of smart consumer electronics such as mobil ...

2012-01 Connectors Molex

[gen 11 2012] Molex introduces the enhanced Small Size Pluggable + (zSFP+) Surface Mount Technology (SMT) 20-way connector that delivers outstanding performance for high-speed telecommunications and data communications equipment. Designed specifically for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the new zSFP+ interconnect components are scalable for next generation applications and pro ...

2012-01 Power Microchip Technology

[gen 10 2012] Microchip Technology announced the introduction of the PIC24F "GA3" 16-bit flash MCU family with a variety of flexible new low-power sleep modes and the industry's lowest operating currents, expanding its ultra-low power (XLP) MCU product line. The PIC24F "GA3" device has a 150 μA/MHz operating current and six DMA channels, allowing programs to be executed with lower power consumption and greater ...

2012-01 Connectors Renesas Electronics America

[gen 9 2012] Renesas Electronics has announced the BCR8LM-14LK, A highly commutative tridirectional triac switching device that supports rated on-state current RMS (IT (RMS)) 8 amps (A) and rated off-state Repeat peak voltage (VDRM) 700 volts, which can be triggered directly by a single chip microcomputer (MCU). The new three-terminal bidirectional thyristor switching device can be used to drive loads such as ...

2012-01 Connectors Maxwell Technologies

[gen 8 2012] Marvell announced the launch of a new generation of forward-looking platforms that will enable major breakthroughs in the convergence of TV, gaming, streaming, web browsing and social media applications. The platform is equipped with the Marvell ARMADA 1500 HD media single-chip system and has been adopted by the next generation Google TV, which will debut at CES 2012. With Marvell's superior Qdeo ...

2012-01 Power Renesas Electronics America

[gen 7 2012] Renesas Electronics, Inc., a leading global supplier of advanced semiconductors and solutions, has announced the development of the industry's first 40nm process embedded flash memory technology for automotive real-time applications. Renesas will also be the first to introduce 40nm embedded flash microcontrollers (MCUS) for automotive applications using the 40nm process flash technology, with the ...

2012-01 Power Xilinx

[gen 6 2012] Xilinx announced a new target reference design and new development substrate based on the 28 nm Kintex™-7 FPGA to accelerate the development of a new generation of 3D and 4K2K display technologies designed to bring richer immersive experiences to consumers. Includes 4K2K Mosaic, HDTV to 4K2K updrive target reference designs, and a new ACDC (Capture, Provide, Distribute, Consume) 1.0 substrate wit ...

2012-01 Connectors Renesas Electronics America

[gen 5 2012] Renesas Electronics, Inc., a leading global supplier of advanced semiconductors and solutions, has announced the development of the industry's first 40nm process embedded flash memory technology for automotive real-time applications. Renesas will also be the first to introduce 40nm embedded flash microcontrollers (MCUS) for automotive applications using the 40nm process flash technology, with the ...

2012-01 Sensors Maxim Integrated

[gen 4 2012] Maxim Integrated Products introduces the MAX44000 digital ambient light and infrared proximity detection sensor that simulates the ambient light detection of the human eye. Designed with the company's proprietary BiCMOS technology, the IC integrates three optical sensors, two ADCs, and digital circuits in a miniature, 2mm x 2mm x 0.6mm package. The highly integrated design saves valuable board sp ...