Technology Articles

2012-03 Power TE Connectivity

[mar 15 2012] TE Circuit Protection, a division of TE Connectivity, has announced a new Metal Hybrid PPTC (MHP) device that provides intelligent activation (SA). This HPP-SA device provides a resettable, cost-effective and space-saving alternative to typical protection methods for high-power lithium battery and module applications. These applications include cordless power tools, electric bicycles and light el ...

2012-03 Connectors Cypress Semiconductor

[mar 14 2012] Cypress Semiconductor introduces the TMA140 TrueTouch controller for lower cost mobile phones. The new family offers high-performance touch screen control for screens up to 5 inches, including multi-finger control support and the industry's best signal-to-noise ratio (SNR). In addition, the new controller supports Cypress's patent-pending Charger Armor feature, which avoids false touch issues cau ...

2012-03 Power MICROSS/On Semiconductor

[mar 13 2012] MIPS Technologies, a leader in industry-standard processor architectures and cores for digital home, networking and mobile applications, and SAI Technology, a leader in secure wireless communications for the global mobile wireless market, today announced that When running SAI's LTE stack with MIPS multithreading technology on user end devices, performance improvements of more than 65% can be achi ...

2012-03 Connectors Microchip Technology

[mar 12 2012] Microchip Technology, the world's leading supplier of integrated microcontrollers, emulators and flash memory patented solutions, announced at Embedded World Congress in Germany that it has launched a new 8-bit single-chip microcomputer (MCU) family using a new generation of analog and digital peripherals for general purpose applications. Ideal for battery charging, LED lighting, ballast control, ...

2012-03 Power Molex

[mar 11 2012] Molex Corporation and TE Connectivity Ltd have entered into a second source agreement. Under the agreement, TE Connectivity will have the right to manufacture, market and sell a number of Molex high-speed interconnect solutions worldwide, including the z-Quad Small Size Pluggable +(zQSFP+) and Small Size Pluggable +(zSFP+). Molex will have the right to manufacture, market and sell TE Connectivity ...

2012-03 Power Analog Devices

[mar 10 2012] Analog Devices announced that Lantronix has selected Analog Devices' iCoupler digital isolator technology to build its new family of wireless communications network servers. The EDS-MD family of multi-port medical device servers represents the latest achievement in medical communications and features a compact, secure and lightweight plastic housing that enables remote control and system-level ma ...

2012-03 Power STMicroelectronics

[mar 9 2012] STMicroelectronics uses advanced technology to develop the latest micro power chip. STOD13AS uses ST's innovative Silicon on Insulator (SOI) process technology for better energy efficiency and longer battery life. Excellent resistance to mobile phone noise ensures that the display is flicker-free, making it ideal for smartphones or portable electronics equipped with AMOLED displays. AMOLED displa ...

2012-03 Power Qualcomm

[mar 8 2012] Qualcomm has introduced the fifth generation of its embedded Gobi reference data connectivity platform, which can be used on mobile devices including ultra-thin laptops, tablets and dual-purpose tablets. Based on Qualcomm Gobi 4G LTE wireless baseband modem MDM9615 And MDM9215 This technology can provide fast LTE connectivity on global FDD and TDD networks, while being backward compatible with HS ...

2012-03 Connectors NXP

[mar 7 2012] NXP Semiconductors and FeliCa Networks announced that they will work closely to ensure that NXP's NFC family of RF controller solutions are interoperable with Japan's FeliCa™ (NFC-F) standard infrastructure. With NXP's single-chip NFC RF controller, device manufacturers will be able to design and produce handsets that are truly interoperable with global infrastructure. NXP and FeliCa Networks pla ...

2012-03 Power Renesas Electronics America

[mar 6 2012] Renesas Electronics and its subsidiary Renesas Mobile Corporation, a provider of advanced wireless modem solutions and platforms, Renesas Communications Technologies announced the MP5232, the first single-chip, high-performance, scalable smartphone platform for the $150- $300 product market. The MP5232 platform is designed to help Oems accelerate the production of LTE/HSPA+ enabled smartphones, t ...

2012-03 Power Renesas Electronics America

[mar 5 2012] Renesas Electronics Corporation announced the launch of a family of five low-power P-channel power metal oxide semiconductor field-effect transistors (MOSFETs). Includes µPA2812T1L optimized for uses such as charge control switches for lithium-ion (Li-ion) secondary batteries in notebook computers and power management switches for power conversion with AC adapters. In recent years, the demand for ...

2012-03 Connectors Microchip Technology

[mar 4 2012] Microchip Technology announced at the Embedded World Conference in Germany that its new 8-bit single-chip microcomputer (MCU) family featuring a new generation of analog and digital peripherals is ideal for general-purpose applications, as well as battery charging, LED lighting, ballast control, power conversion and system control applications. The PIC12F(HV)752 MCU integrates complementary outpu ...