Technology Articles

2017-10 Passive Components Infineon Technologies

[ott 6 2017] Infineon Technologies AG introduces the sixth generation 650 V CoolSiCTM Schottky diode, the latest addition to the CoolSiC diode product family. It builds on the distinctive characteristics of fifth-generation products to ensure reliability, quality and efficiency. The CoolSiC G6 diode is the perfect complement to the 600 V and 650 V CoolMOSTM 7 product family. They target current and future ser ...

2017-10 Connectors Vishay

[ott 5 2017] Vishay Intertechnology has announced the launch of a new series of surface mount TMBS Trench MOS Barrier Schottky rectifiers in the SlimDPAK(TO-252AE) package from the eSMP family. Vishay General Semiconductor rectifiers are thinner than other DPAK(TO-252AA) packaged devices, and have better heat dissipation, reverse voltages from 45V TO 150V, lower forward conduction voltages, and higher current ...

2017-10 Semiconductors KEMET

[ott 4 2017] KEMET, the world's leading supplier of electronic components, has announced the launch of its KPS MCC C0G high temperature 200°C large capacitor solution for harsh environment applications. Developed by combining Kimi Electronics' patented stable C0G/NPO base metal electrode (BME) dielectric system with durable lead | wire frame technology, these capacitors are ideally suited for high temperature ...

2017-10 Semiconductors STMicroelectronics

[ott 4 2017] STMicroelectronics, the world's leading semiconductor supplier across multiple electronic applications, has released a new Bluetooth software development tool that enables developers to use the latest Bluetooth wireless networking technology to develop smart connected products and drive innovation in the next generation of mobile phone-controlled products. The Bluetooth Technology Alliance (SIG) ...

2017-10 Passive Components Littelfuse

[ott 3 2017] Littelfuse announced the launch of the 0.9pF +30kV distributed unidirectional Transient Suppression Diode Array (SPA@ diode) family. The SP3222 series transient suppression diode array combines a low capacitance rail to rail diode with an additional Zener diode diode to protect electronic devices from destructive electrostatic discharge (ESD). This powerful - electrode is AEC-Q101 compliant and s ...

2017-10 Semiconductors ON Semiconductor

[ott 3 2017] Driving energy efficient innovation, ON Semiconductor introduces a new programmable RF transceiver System-on-chip package (SiP) that integrates an advanced RF system single-chip (SOC) with all surrounding bill of materials, including a thermocooled crystal oscillator TCXO. AX-SIP-SFEU offers the most integrated Sigfox solution for both upstream (send) and downstream (receive) communications. This ...

2017-10 Semiconductors Microchip Technology

[ott 2 2017] Microchip Technology announced the launch of PAC1934, a high-precision power and energy monitoring chip that is fully compatible with the Energy Estimation Engine (E3) built into the Windows 10 operating system. On battery-powered Windows10 devices, the measurement accuracy is up to 99%. Microchip's PAC 1934 and Windows 10 drivers, combined with Microsoft's E3 service, improved battery usage meas ...

2017-10 Sensors Vishay

[ott 2 2017] Vishay Intertechnology has announced the release of the first ultra-thin, high-current IHLP inductor with extended frequency range, the IHLP-1616BZ-0H. The new IHLP 1616BZ-0H series has a high frequency performance of 10 MHZ, with the lowest loss of inductors currently on the market at 1MHz and above. By using the IHLP-1616BZ-0H, design engineers can improve efficiency and potentially reduce the ...

2017-10 Semiconductors NXP

[ott 1 2017] NXP Semiconductor, the world's largest supplier of automotive semiconductor solutions, has expanded its leadership in secure vehicle-to-many (V2X) communications with the release of its next-generation RoadLINKTM solution. The new NXP SAF5400 is the world The first automotive standard compliant high-performance single-chip DSRC modem features a unique scalable architecture, industry-leading new s ...

2017-10 Semiconductors NXP

[ott 1 2017] HELL A Aglaia and NXP are expanding the current ADAS vehicle vision platform with the addition of artificial intelligence (AI) expected in 2018. HELL AAglaia's ADAS platform, powered by NXP's S32 and i.MX automotive-grade processors, enables secure, scalable and comprehensive NCAP forward-looking capabilities, enabling 0EM to deploy the ADAS platform into production vehicles. The next step in the ...

2017-09 Passive Components Harwin Inc.

[set 15 2017] Harwin continues to strengthen its portfolio of interconnect solutions for harsh application environments by adding new products to its flagship Datamate Hi-Rel product family. In response to space-constrained RF/wireless designs, each member of the Datamate Coax family includes multiple (linked) coaxial contacts in a compact housing. Because they provide access to multiple coaxial lines through ...

2017-09 Connectors Renesas Electronics America

[set 14 2017] Intersil announced the launch of two new high-speed isolated RS-485 differential bus transceivers, ISL32741E and ISL32740E, that provide 40Mbps two-way data communication for Industrial Internet of Things (IIoT) networks. The ISL32741E offers 1,000 VRMS operating voltage and 6kV enhanced isolation, more than 2 times higher than competing solutions, and meets the higher operating voltage and enhan ...